The new Clip packaging process further improves the power density and efficiency of the system
Voltage resistance level: 30~250V, internal resistance 0.8~40MR
Product features: Advanced manufacturing technology, better process conditions, and finely optimized device structure are adopted, with lower internal resistance and ultra-low gate charge (Qg). The new Clip packaging process is used to further improve the power density and efficiency of the system, and the superior consistency of VTH 0.2 graded materials is tested.
Application areas: motor drive, battery management system, switch mode power supply (SMPS) synchronous rectification, new energy vehicle OBC, other DC/DC and other fields.
Phone:
Email:
Address:
Room 13A07, Building B, Haisong Mansion, No. 9 Tairan Road, Chegongmiao, Futian District, Shenzhen
Enterprise Official Account
Copyright © Shenzhen LGE Electronic Technology Co., Ltd. All rights reserved.